Product Introduction
- Product Introduction
- Bump
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| PROCESS | BASE METAL | APPLICATION | CHEMICAL TYPE L(liquid), P(powder) | SPEC |
|---|---|---|---|---|
| WAFER BUMPING PROCESS |
Cu, Ni | Surfactant for Copper bump etchant | L | Customization is available to perfectly align with the customer’s specific requirements. |
| Copper bump etchant | L | |||
| TiW | Alkali type TiW bump etchant | L | ||
| Ti | Acid type Ti bump etchant | L | ||
| Alkali type Ti bump etchant | L | |||
| Ni | Nickel bump etchant | L | ||
| Ni-V | Nickel-Vanadium alloy bump etchant | L | ||
| Al | Aluminium bump etchant | L | ||
| Au | Gold bump etchant | L |