Product Introduction
- Product Introduction
- IC Package process
IC Package process
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| PROCESS | APPLICATION | BASE METAL | DESCRIPTION | CHEMICAL TYPE L(liquid), P(powder) | SPEC |
|---|---|---|---|---|---|
| IC PACKAGE PROCESS |
DESCALER | Cu | Descaler for all kinds of Copper alloys | P | Customization is available to perfectly align with the customer’s specific requirements. |
| NiFe | Strong pretreatment to improve adhesion better | L | |||
| METAL STRIPPER | Sn, SnBi, SnAg | Rework stripper, Belt stripper | L | ||
| MOLD DEFLASHER | Cu | mold flash remover | L | ||
| AuAg | Dip type mold flash remover for PPF | L | |||
| PR STRIPPER | Cu | Photoresist stripper | L | ||
| FLUX CLEANER | Cu | Flux cleaner | L |