HOME   CONTACT US
 
 
HOME > Product Intro > Bump   


Process
Metal
Name
type
Usage & Feature
Bump etch
Ti
Ti etchant
L
Fast etching, No under-cut problem, No solder attack
Uni-Ti2
L
No solder and Al damage, No residue, No undercut (H2O2 base)
Ti7
L
Weak alkali type, No undercut
Ti-W
Ti-W etchant
L
Ammonium base, No solder damage
Uni-TiW
L
H2O2 base, No solder damage, No undercut
Ti7
L
H2O2 base, No undercut, No solder damage, strong
Ni
Ni etchant
L
Uniform etching
Ni-V
Ni-V etchant
L
Fast speed
Ni-V
Ni-V etchant 2
L
No solder damage
Cu
Cu etchant 3
L
No solder damage, H2O2 base
Uni-Cu
L
No solder damage No undercut
Cu
Activator 1
L
Pre-treatment acid cleaner for Bump
Au
Uni-Au
L
Fast and uniform etching
Ni-V/Cu
UC-7000
L
NiV/Cu etchant, uniform and no under-cut
 
UC-30
L
Surfactant for acid etchant for Bump
Stripper
PR
UniPR-100
L
Negative & positive Photoresist stripper, No metal damage

 

 

 

 

 

 

 
No.506, New T Castle, 429-1, Gasan-dong, Geumcheon-gu, Seoul, Korea
TEL: +82-2-2626-8970 FAX : +82-2-2626-8978
#63, hwanggeumro 4, Gimpo-si, Yangchon-eup, Gyeonggi-do, Korea
TEL : +82-31-988-8878 FAX : +82-31-629-7748